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Ecoclean and EnPak opened a joint Clean & Pack Technology Center in Warsaw, Indiana, expanding U.S.-based capabilities for validated precision cleaning, controlled handling, and compliant packaging of medical device components.
Designed specifically for the needs of medical device OEMs, contract manufacturers, and critical supply‑chain partners, the facility combines process development, industrial trials, and scalable contract services within a single, integrated workflow.
The new Technology Center helps customers develop, validate, and transfer cleaning processes into production without the immediate need for capital investment in in-house equipment and infrastructure. Typical applications include orthopedic implants, surgical instruments, dental components, and other specialized parts that require cleaning and compliant packaging.
“This Technology Center reflects what MedTech manufacturers are asking for today: reliable cleaning results paired with downstream processes that protect cleanliness through packaging and shipment,” says Sandro Siminovich, Driector of Sales, Ecoclean Inc. “Customers can run trials under production-relevant conditions, generate the documentation they need, and scale into contract cleaning using validated processes.”
Marlene Betances, President and Partner, EnPak LLC, adds: “By integrating cleaning with controlled packaging and logistics, we reduce handoffs and risk points in the supply chain. That helps customers maintain product integrity while meeting regulatory and quality-system expectations.”
Source: Ecoclean and EnPak
